Protect electronic devices from moisture and ESD. These aluminized and heat-sealable moisture barrier bags display ESD protective and moisture sensitive symbols and a lot code for traceability.
Protect electronic devices from moisture and ESD. These aluminized and heat-sealable moisture barrier bags display ESD protective and moisture sensitive symbols and a lot code for traceability.
Protect moisture and ESD-sensitive items with these moisture barrier bags suitable for vacuum packaging and heat sealing. In addition, these bags feature polyester for puncture resistance.
Features
| Moisture Vapor Transmission Rate (MVTR) | <0.03grams/100sq. in./24hrs MIL-STD-3010C Method 3030 | 
| Tensile Strength | 7800psi, 54MPa ASTM D882 | 
| Puncture Resistance | 20lbs, 89 N MIL-STD-3010 Method 2065 | 
| Seal Strength | 16lbs, 71 N ASTM D882 | 
| Thickness | 3.6mils, 0.091mm +/-10% MIL-STD-3010 Method 1003 | 
| Marking Adhesion | Pass IPC-TM-650 2.4.1 | 
| ESD Shielding | <10nJ ANSI/ESD STM11.31 | 
| Heat Sealing Temperature | 300 to 400°F (140 to 204°C) | 
| Heat Sealing Time | 0.6 to 4.5 seconds | 
| Heat Sealing Pressure | 30 to 70psi, 206 to 482kpa | 
| Moisture Vapor Transmission Rate (MVTR) | <0.03grams/100sq. in./24hrs MIL-STD-3010C Method 3030 | 
| Tensile Strength | 7800psi, 54MPa ASTM D882 | 
| Puncture Resistance | 20lbs, 89 N MIL-STD-3010 Method 2065 | 
| Seal Strength | 16lbs, 71 N ASTM D882 | 
| Thickness | 3.6mils, 0.091mm +/-10% MIL-STD-3010 Method 1003 | 
| Marking Adhesion | Pass IPC-TM-650 2.4.1 | 
| ESD Shielding | <10nJ ANSI/ESD STM11.31 | 
| Heat Sealing Temperature | 300 to 400°F (140 to 204°C) | 
| Heat Sealing Time | 0.6 to 4.5 seconds | 
| Heat Sealing Pressure | 30 to 70psi, 206 to 482kpa |